Method of depositing a coating utilizing a coating apparatus

ABSTRACT

A method of depositing a coating utilizing a coating apparatus includes providing a coating apparatus above a glass substrate and forming a coating on a surface of the glass substrate while flowing a fluorine-containing compound into the coating apparatus. The fluorine-containing compound inhibits the formation of the coating on one or more portions of the coating apparatus.

CROSS REFERENCE TO RELATED APPLICATION

This application is claiming the benefit, under 35 U.S.C. 119(e), of theprovisional application which was granted Ser. No. 61/677,277 filed onJul. 30, 2012, the entire disclosure of which is hereby incorporated byreference.

BACKGROUND OF THE INVENTION

The invention relates to a method of depositing a coating using acoating apparatus. More specifically, the invention relates to a methodwhich inhibits the formation of the coating and by-products which resultfrom the deposition of the coating on the coating apparatus during thedeposition of the coating on a glass substrate.

Thin film coatings may be formed using a coating apparatus to deposit athin film coating on, for example, a glass substrate during the glassmanufacturing process. However, the processes known for the productionof coatings which comprise oxides of silicon on glass substrates utilizeprecursor materials (reactants) which can react undesirably. Forexample, known precursor materials may react to form by-products beforeand during formation of the coating on the glass substrate. Theresulting by-products, which often take the form of fine particles orpowder, can create blockages in the coating apparatus. To produce anaesthetically-pleasing and uniform coating on the glass substrate, thepowder must be removed from the coating apparatus.

Various methods for removing powder from a coating apparatus are known.For example, powder can be removed mechanically from a coatingapparatus. Mechanical removal of powder can be performed afterdepositing the coating. However, this method suffers from shorteneddeposition run times and is time consuming and labor intensive.

Alternatively, U.S. Pat. No. 6,857,433 teaches a cleaning method for aglass-coating reactor. The method requires that the reactor contain aglass substrate within a chamber and that the flow of the deposition gasto the reactor be terminated. Next, a cleaning gas is added to thereactor to react with substances formed on an internal surface of thechamber. This method also suffers from shortened deposition runs as thecoating process is interrupted to remove the substances formed on thechamber.

Therefore, it is desired to devise an improved process for thedeposition of coatings which comprise an oxide of silicon over glasssubstrates.

BRIEF SUMMARY OF THE INVENTION

A method of depositing a coating utilizing a coating apparatus isprovided. In an embodiment, the method comprises providing a coatingapparatus above a glass substrate and forming a coating on a surface ofthe glass substrate while flowing a fluorine-containing compound intothe coating apparatus. The fluorine-containing compound inhibits theformation of the coating on one or more portions of the coatingapparatus.

In another embodiment or aspect, the method comprises providing acoating apparatus above a moving glass substrate. The coating apparatushas one or more exhaust gas passages. The method also comprises forminga silica coating on a surface of the glass substrate while flowing afluorine-containing compound into the coating apparatus. The silicacoating contains no fluorine or only trace amounts thereof. Thefluorine-containing compound inhibits the formation of the silicacoating in the one or more exhaust gas passages.

Preferably, the coating comprises an oxide of silicon. Preferably, theglass substrate is moving. Preferably, the method further comprisespositioning the coating apparatus within a deposition chamber.Preferably, the coating is formed on the surface of the glass substrateby chemical vapor deposition. Preferably, the glass substrate is at atemperature of between about 1050° F. (566° C.) and 1400° F. (760° C.).Preferably, the coating contains no fluorine or only trace amountsthereof.

Preferably, the coating apparatus comprises one or more exhaust gaspassages and the fluorine-containing compound is introduced into anexhaust gas passage. Preferably, the fluorine-containing compound isanhydrous HF. Preferably, the fluorine-containing compound inhibits theformation of the coating within one or more exhaust gas passages.Preferably, the fluorine-containing compound inhibits the formation ofthe coating on a surface of the coating apparatus.

Preferably, the method comprises forming a gaseous mixture comprising asilicon-containing compound, an oxygen-containing compound and a radicalscavenger, flowing the gaseous mixture into the coating apparatus anddirecting the gaseous mixture through the coating apparatus to thesurface of the glass substrate.

Preferably, the fluorine-containing compound flows into the coatingapparatus prior to forming the coating on the surface of the glasssubstrate. Preferably, the coating is a silica coating. Preferably, thefluorine-containing compound is introduced into each exhaust gas passagevia separate gas distribution tubes. Preferably, the ratio offluorine-containing compound to silicon-containing compound flowing intothe coating apparatus is equal to or greater than 2:1. Preferably, theratio of fluorine-containing compound to silicon-containing compoundflowing into the coating apparatus is equal to or greater than 4:1.

In a further aspect, the invention provides a method of depositing acoating utilizing a coating apparatus, comprising: providing a coatingapparatus which comprises one or more exhaust gas passages above amoving glass substrate; and forming a silica coating on a surface of theglass substrate which contains no fluorine or only trace amounts thereofwhile flowing a fluorine-containing compound into the coating apparatus,wherein the fluorine-containing compound inhibits the formation of thesilica coating in the one or more exhaust gas passages.

Preferably, the glass substrate is at a temperature of between about1050° F. (566° C.) and 1400° F. (760° C.).

Preferably, the method further comprising forming a gaseous mixturecomprising a silicon-containing compound, an oxygen-containing compoundand a radical scavenger, flowing the gaseous mixture into the coatingapparatus and directing the gaseous mixture through the coatingapparatus to the surface of the glass substrate and wherein the ratio offluorine-containing compound to silicon-containing compound flowing intothe coating apparatus is equal to or greater than 4:1.

In a further aspect, the invention provides a coated glass substratecomprising a coating, the coating being deposited by utilizing a coatingapparatus, comprising: providing a coating apparatus above a glasssubstrate; and forming a coating on a surface of the glass substratewhile flowing a fluorine-containing compound into the coating apparatus,wherein the fluorine-containing compound inhibits the formation of thecoating on one or more portions of the coating apparatus.

All of the features described herein may be combined with any one of theabove aspects, in any combination.

The above, as well as other advantages of the present invention willbecome readily apparent to those skilled in the art from the followingdetailed description when considered in the light of the accompanyingdrawings in which:

FIG. 1 shows a schematic view of a float glass installation according toan embodiment of the invention;

FIG. 2 shows a schematic view of a coating apparatus according to anembodiment of the invention;

FIG. 3 shows a cross-sectional view of the coating apparatus of FIG. 2;

FIG. 4 shows a perspective view of a gas distribution tube according toan embodiment of the invention; and

FIG. 5 shows a perspective view of a portion of the gas distributiontube of FIG. 4.

DETAILED DESCRIPTION OF THE INVENTION

It is to be understood that the invention may assume various alternativeorientations and step sequences, except where expressly specified to thecontrary. It is also to be understood that the specific apparatuses andmethods illustrated in the attached drawings, and described in thefollowing specification are simply exemplary embodiments of theinventive concepts. Hence, specific dimensions, directions, or otherphysical characteristics relating to the embodiments disclosed are notto be considered as limiting, unless expressly stated otherwise.

A method of depositing a coating is provided. Referring now to FIG. 1,in an embodiment, the method comprises providing a coating apparatus 10above a glass substrate 12 and forming the coating on a surface 14 ofthe substrate 12 while flowing a fluorine-containing compound into thecoating apparatus 10. Preferably, the coating contains no fluorine oronly trace amounts thereof. The fluorine-containing compound inhibitsthe formation of the coating and/or by-products resulting from thedeposition of the coating on one or more portions of the coatingapparatus 10. As used herein, the term “inhibits,” derivatives thereof,and other terms of similar import refers to the removal or prevention ofthe coating and/or by-products resulting from the deposition of thecoating from forming on one or more portions of the coating apparatus.

Preferably, the coating comprises an oxide of silicon. More preferably,the coating is of silicon dioxide (SiO₂) which hereinafter will bereferred to as “silica.” Preferably, the silica coating comprisesessentially silicon and oxygen. However, trace amounts of contaminantsof, for example, carbon and/or fluorine may be contained in the silicacoating.

The method will be described in connection with depositing a silicacoating. However, it should be appreciated that the method is notlimited in use with the deposition of silica coatings. For example, asilicon oxycarbide or silicon oxynitride coating may be depositedutilizing the method.

In certain embodiments, the method will be described in connection withforming a coated glass article. The coated glass article may have manyuses and can be utilized in many applications. For example, the coatedglass article may be utilized in architectural glazings. The coatedglass article can also be utilized in solar, electronic, automotive andaerospace applications.

Preferably, the coating apparatus 10 is positioned within a depositionchamber 18. The method can advantageously be performed in situ while thecoating apparatus 10 is positioned within the deposition chamber 18.Additionally, the method does not require discontinuing forming thecoating on the glass substrate 12. Thus, the method described hereinallows for longer deposition runs than those known. Finally, the methodinhibits the formation of by-products which result from the depositionof the coating such as, for example, silicon oxide, whereas knownprocesses attempt to remove by-products after they form.

Preferably, the silica coating is formed utilizing precursor materialsand by a chemical vapor deposition (CVD) method. More preferably, thedeposition surface 14 of the glass substrate 12 is at essentiallyatmospheric pressure when the silica coating is formed thereover orthereon. Thus, the silica coating may be formed by an atmosphericpressure CVD (APCVD) method. However, it should be appreciated that thesilica coating may be formed by another CVD method.

A feature of the method is that it allows for the formation of thesilica coating at a commercially viable deposition rate and, asabove-noted, does not require discontinuing the formation of the silicacoating on the glass substrate or displacing the coating apparatus 10until it is desired to do so. High deposition rates are important whendepositing coatings on a glass substrate. This is particularly true ifthe glass substrate 12 is a glass ribbon travelling at a line speed inthe range of several hundred inches per minute and it is desired todeposit the silica coating at a specific thickness in fractions of asecond. For example, the method inhibits the formation of the coatingand/or by-products on one or more portions of the coating apparatus 10while forming the silica coating on the deposition surface 14 of theglass substrate 12 at a deposition rate of, for example, about 5 or morenanometers per second (nm/sec).

For any particular combination of precursor materials, the optimumconcentrations and flow rates for achieving a particular silicadeposition rate on the glass substrate may vary. Also, as should beappreciated, for any particular combination of precursor materials, theoptimum concentrations and flow rates for achieving a particulardeposition rate may be determined by trial or by computer modeling. Itwill also be appreciated that the use of higher concentrations and/orhigher flow rates of a particular precursor material may result in lessefficient overall conversion of the reactants into the silica coating,so that the optimum conditions for commercial operation may differ fromthe conditions which provide the highest deposition rates.

In an embodiment, the glass substrate 12 is a soda-lime-silica glass. Inthis embodiment, the glass substrate 12 may be substantiallytransparent. However, the method is not limited to transparent glasssubstrates as translucent glass substrates may also be utilized inpracticing the method. Furthermore, the transparency or absorptioncharacteristics of the glass substrate 12 utilized may vary betweenembodiments of the invention. Likewise, the invention is not limited toutilizing a substrate 12 having a particular composition as, forexample, glass substrates 12 of a borosilicate composition can beutilized in the method. Additionally, the method is not limited to aparticular glass substrate thickness.

In an embodiment, the method may be practiced under dynamic depositionconditions. In this embodiment, the glass substrate 12 is moving duringformation of the silica coating. In another embodiment, the glasssubstrate 12 may be heated. Preferably, in this embodiment, thetemperature of the glass substrate 12 is between about 1050° F. (566°C.) and 1400° F. (760° C.) when the silica coating is formed thereoveror thereon. Preferably, the glass substrate 12 is moving and heated whenpracticing the method.

The method may be practiced in conjunction with the manufacture of theglass substrate 12. The manufacture of the glass substrate 12 may becarried out utilizing the well-known float glass manufacturing process.In these embodiments, it is preferred that the glass substrate 12 is aglass ribbon and, when these embodiments of the method are beingdescribed, the glass substrate 12 may be referred to herein as such.Most preferably, the glass substrate 12 is moving, heated and a glassribbon when practicing the method.

An exemplary illustration of a float glass installation 20 utilized inthe float glass manufacturing process is shown in FIG. 1. It should beappreciated that the float glass installation 20 described herein andshown in FIG. 1 is only illustrative of such installations and that themethod is not limited to use with only the installation of FIG. 1. Also,it should be appreciated that the method can be practiced apart from thefloat glass manufacturing process or well after formation and cutting ofthe glass substrate.

As illustrated in FIG. 1, the float glass installation 20 comprises acanal section 22 along which molten glass 24 is delivered from a meltingfurnace, to a float bath section 25 where the glass ribbon is formed.The glass ribbon advances from the float bath section 25 through anadjacent annealing lehr 26 and a cooling section 28. The float bathsection 25 includes a bottom section 30 within which a bath of moltentin 32 is contained, a roof 34, opposite sidewalls (not shown) and endwalls 36. In this embodiment, the roof 34, sidewalls and end walls 36together define the deposition chamber 18. For describing this and otherembodiments, the deposition chamber 18 may be referred to as a floatbath chamber. In these embodiments, a non-oxidizing atmosphere ismaintained in the deposition chamber 18.

The glass ribbon is removed from the float bath section 25 over lift outrolls 40 and is thereafter conveyed through the annealing lehr 26 andthe cooling section 28 on aligned rolls. The deposition of the silicacoating preferably takes place in the float bath section 25 and,specifically, the float bath chamber. However, it may be possible fordeposition to take place further along the glass production line, forexample, in a gap 42 between the float bath section 25 and the annealinglehr 26, or in the annealing lehr 26.

The non-oxidizing atmosphere is generally nitrogen or a mixture ofnitrogen and hydrogen in which nitrogen predominates and is maintainedin the float bath chamber to prevent oxidation of the molten tin 32. Theatmosphere gas is admitted through conduits 43 operably coupled to adistribution manifold 45. The non-oxidizing gas is introduced at a ratesufficient to compensate for normal losses and maintain a slightpositive pressure, on the order of about 0.001 to about 0.01 atmosphereabove ambient atmospheric pressure, so as to prevent infiltration ofoutside atmosphere.

For purposes of describing the method, the above-noted pressure range isconsidered to constitute normal atmospheric pressure. It should be notedthat in addition to the pressure of the float bath chamber, the pressureof the annealing lehr 26 and/or in the gap 42 between the float bathsection 25 and the annealing lehr 26 may be at essentially atmosphericpressure and the coating apparatus 10 may be located therein to practicethe method. However, it should also be noted that the method is notlimited to being practiced at essentially atmospheric pressure. Thus,the silica coating may be formed and the method may be practiced underlow-pressure conditions.

Heat for maintaining the desired temperature regime in the molten tin 32and the float bath chamber is provided by radiant heaters 44 within thechamber. The atmosphere within the lehr 26 is typically atmospheric air,as the cooling section 28 is not enclosed and the portion of the glassribbon therein is open to the ambient atmosphere. Ambient air may bedirected against the glass ribbon as by fans 46 in the cooling section28. Heaters (not depicted) may also be provided within the annealinglehr 26 for causing the temperature of the glass ribbon to be graduallyreduced in accordance with a predetermined regime as it is conveyedthere through.

The precursor materials utilized to form the silica coating aredelivered at a temperature below the temperature at which they react toform the silica coating and the glass substrate 12 is at a temperatureabove the reaction temperature. Such materials may at some point be aliquid or a solid but are volatile such that they can be vaporized foruse in a gaseous state. Once in a gaseous state, the precursor materialsare delivered to the deposition surface 14 of the glass substrate 12 andchemically react in a predetermined manner. The reaction results in thedeposition of the silica coating on the glass substrate 12.

The gaseous precursor materials are mixed to form the silica coating onthe glass substrate 12. The precursor materials may be mixed within oroutside of the coating apparatus 10 to form the gaseous mixture. In anembodiment, separate supply lines extend from the sources of theprecursor materials to the coating apparatus 10. In this embodiment, theprecursor materials are mixed within the coating apparatus 10 or outsideof the coating apparatus 10 after being discharged therefrom to form thegaseous mixture. Alternatively, the precursor materials may be suppliedto the coating apparatus 10 in a single feed. In this embodiment, thegaseous mixture of precursor materials is formed prior to being fed tothe coating apparatus 10.

Preferably, the gaseous mixture includes precursor materials suitablefor forming the silica coating at essentially atmospheric pressure. Inan embodiment, the gaseous mixture of precursor materials comprises asilicon-containing compound, an oxygen-containing compound, and aradical scavenger.

Preferably, the silicon-containing compound is a silane compound. Apreferable silane compound is monosilane (SiH₄). However, the method isnot limited to utilizing only monosilane as other silane compounds aresuitable for use in forming the silica coating. For example,diclorosilane (SiH₂Cl₂) and/or trichlorosilane (SiHCl₃) are suitablesilane compounds for use in forming the silica coating.

Preferably, the oxygen-containing compound is oxygen (O₂) or water(H₂O). Oxygen may be provided as a part of a gaseous composition such asair. In another embodiment, oxygen is provided in a substantiallypurified form. In either embodiment, the oxygen is in the form ofmolecular oxygen. Water may be provided as steam. The gaseous precursormixture may also comprise both oxygen and water.

Preferably, the radical scavenger is a hydrocarbon gas. Preferredhydrocarbon gases are ethylene (C₂H₄) or propylene (C₃H₆). U.S. Pat. No.5,798,142, which is incorporated by reference in its entirety herein,teaches the formation of a silica coating by combining a radicalscavenger, silane, oxygen, and a carrier gas to form a gaseous precursormixture.

Inert gas may be utilized with the precursor materials as carrier and/ordiluent gas. Suitable inert gases include nitrogen (N₂), hydrogen (H₂),helium (He) and mixtures thereof. In an embodiment, the precursormixture includes one or more inert gases selected from the groupconsisting of N₂, H₂, He and mixtures thereof.

A coating apparatus 10 suitable for use in the method is bestillustrated in FIGS. 2 and 3. The precursor materials flow into thecoating apparatus 10 via one or more inlets 47. The one or more inletsare in fluid communication with a conduit 49 which directs the precursormaterials through the coating apparatus 10. The conduit 49 is in fluidcommunication with an outlet 54. The precursor materials are dischargedfrom the coating apparatus 10 from the outlet 54.

The coating apparatus 10 may comprise a long axis 48 and be of a lengthL that is substantially equal to, slightly less than or slightly greaterthan the width of the glass substrate 12. Additionally, as depicted inthe embodiment of FIG. 2, the coating apparatus 10 may have a generallyrectangular shape. However, as should be appreciated, the method may beutilized with a coating apparatus having a configuration which differsfrom the above-described and further descriptions of coating apparatusessuitable for practicing the method can be found in U.S. Pat. No.4,922,853 and U.S. patent application Ser. No. 13/426,697, the entiredisclosures of which are hereby incorporated by reference.

The internal temperature of the coating apparatus 10 may be controlled.The internal temperature of the coating apparatus 10 may be controlledby any suitable means. For example, the temperature of the coatingapparatus 10 may be controlled by utilizing a suitable heat transfermedium in certain portions 50 of the coating apparatus 10.

In certain embodiments, the coating apparatus 10 may comprise one ormore face portions 52. As shown in FIG. 2, in an embodiment, the coatingapparatus 10 comprises two face portions 52. The precursor materials aredischarged from the outlet 54 which is adjacent and separates the faceportions 52 from each other. Thus, the precursor materials aredischarged from the coating apparatus 10 between the face portions 52.

Each face portion 52 comprises a face surface 53. The face surfaces 53are aligned with each other and positioned in a parallel relationshipwith the glass substrate 12. The face portions 52 and outlet 54 are oflengths which may be substantially equal. In an embodiment, the lengthsof the face portions 52 and outlet 54 are substantially equal to thelength L of the coating apparatus 10.

Preferably, the coating apparatus 10 comprises one or more exhaust gaspassages 56. As illustrated in FIG. 3, the coating apparatus 10 maycomprise two exhaust gas passages 56. The exhaust gas passages 56 allowfor the continuous removal of spent or unused gaseous precursormaterials and/or inert gases which might otherwise create undesiredcontaminants on the deposition surface 14 of the glass substrate 12. Theexhaust gas passages 56 are separated from the outlet 54 by the faceportions 52 of the coating apparatus 10. In this embodiment, eachexhaust gas passage 56 is positioned adjacent a face portion 52.

Each exhaust gas passage 56 is at least partially defined by one or moresidewalls 58. Also, each exhaust gas passage 56 includes an opening 60which receives the spent or unused gaseous precursor materials and/orinert gases. In certain embodiments, the opening 60 is of a length whichis substantially equal to the length L of the coating apparatus 10. Whenthe coating apparatus 10 is positioned within the deposition chamber 18and above the glass substrate 12, the outlet 54 and exhaust gas opening60 are provided near the deposition surface 14 of the glass substrate12.

At least one baffle 62 may be provided within each exhaust gas passage56. The at least one baffle 62 helps to ensure that the spent or unusedprecursor materials and/or inert gases are uniformly removed from thedeposition chamber 18. The at least one baffle 62 may be configured asan elongated sheet and be formed of corrosion resistant metal. The atleast one baffle 62 is preferably attached to a sidewall 58 andpositioned in a substantially parallel relationship with the long axis48 of the coating apparatus 10.

Preferably, the coating apparatus 10 is provided in the depositionchamber 18 at a predetermined distance above the glass substrate 12. Asshown in FIG. 1, when the method is practiced in conjunction with thefloat glass manufacturing process, the coating apparatus 10 may beprovided in the float bath chamber. However, it should be appreciatedthat the coating apparatus 10 may be provided in another portion of thefloat bath section 25, the annealing lehr 26, and/or in the gap 42between the float bath section 25 and the annealing lehr 26.

The fluorine-containing compound may at some point be a liquid or asolid but is volatile such that it can be vaporized into a gaseous stateprior to flowing into the coating apparatus 10. Preferably, thefluorine-containing compound is hydrogen fluoride (HF). More preferably,the fluorine-containing compound is anhydrous HF. However, it should beappreciated that alternative fluorine-containing compounds may beutilized in practicing the method.

The method may comprise providing a source 80 of the fluorine-containingcompound. The fluorine-containing compound flows from its source 80 intothe coating apparatus 10. In an embodiment, the method comprisesintroducing the fluorine-containing compound at one or more locationswithin the coating apparatus 10. Preferably, in this embodiment, thefluorine-containing compound is introduced into an exhaust gas passage56. More preferably, the fluorine-containing compound is introduced intoseparate exhaust gas passages 56. However, it should be appreciated thatthe fluorine-containing compound may be introduced into one or morealternative locations within the coating apparatus.

For any particular combination of precursor materials, the optimum flowrate of the fluorine-containing compound for inhibiting the formation ofthe coating and/or by-products on one or more portions of the coatingapparatus 10 may vary. However, the flow rate of fluorine-containingcompound needed to inhibit the formation of the coating and/orby-products on one or more portions of the coating apparatus 10 maydepend on the amount of silicon-containing compound flowing into thecoating apparatus 10. Thus, in certain embodiments, the method comprisesflowing a selected ratio of fluorine-containing compound tosilicon-containing compound into the coating apparatus 10. Preferably,the ratio of fluorine-containing compound to silicon-containing compoundflowing into the coating apparatus 10 is selected to be equal to aboutor greater than 2:1. More preferably, the ratio of fluorine-containingcompound to silicon-containing compound flowing into the coatingapparatus 10 is selected to be equal to about or greater than 4:1.Further, the ratio of fluorine-containing compound to silicon-containingcompound flowing into the coating apparatus 10 may be selected to beequal to about or greater than 5:1.

In certain embodiments, it may be desirable to flow thefluorine-containing compound into the coating apparatus 10 in a uniformmanner. In these embodiments and as illustrated in FIG. 3, a gasdistribution tube 64 is positioned within the coating apparatus 10.Preferably, the fluorine-containing compound is directed through the gasdistribution tube 64 before flowing into the coating apparatus 10. Asthe fluorine-containing compound can be introduced into the coatingapparatus 10 at one or more locations, a plurality of gas distributiontubes 64 may be provided within the coating apparatus 10. For example,as shown in FIG. 3, a gas distribution tube 64 may be provided in eachexhaust gas passage 56.

Each gas distribution tube 64 is preferably positioned adjacent the atleast one baffle 62. The gas distribution tube 64 may be positionedabove the at least one baffle 62 or, as shown in FIG. 3, below the atleast one baffle 62. Preferably, each gas distribution tube 64 ispositioned in a parallel relationship with the long axis 48 of thecoating apparatus 10. Each gas distribution tube 64 may be secured to asidewall 58 of the exhaust gas passage 56. As shown in FIG. 4, aplurality of supports 66 are provided to secure the gas distributiontube 64 to the sidewall 58 of the exhaust gas passage 56. The supports66 may be equally spaced apart along the gas distribution tube 64.

An embodiment of the gas distribution tube 64 suitable for use inpracticing the method is shown best in FIGS. 4 and 5. The gasdistribution tube 64 is preferably metallic. Also, as thefluorine-containing compound and the environment within and adjacent thecoating apparatus 10 may be corrosive, it is preferred that the gasdistribution tube 64 is formed from a corrosion resistant metal or metalalloy. In an embodiment, the gas distribution tube 64 comprises nickel.

The gas distribution tube 64 comprises a cylindrical portion 68 which ishollow and has a plurality of equally spaced holes 70 formed therein.Preferably, the cylindrical portion 68 has a closed-end 72 and anoppositely positioned open-end 74. The gas distribution tube 64 may havea long axis 76 which is substantially equal in length L_(t) to thelength L of the coating apparatus 10. In an embodiment, thefluorine-containing compound flows into the open end 74 of the gasdistribution tube 64 and is introduced into the coating apparatus 10through the plurality of holes 70 formed in the cylindrical portion 68.

Preferably, the fluorine-containing compound flows into the coatingapparatus 10 prior to forming the silica coating, i.e. before theprecursor materials flow into the coating apparatus 10, and is of a flowrate which is substantially maintained during the formation of thesilica coating. However, the fluorine-containing compound may initiallyflow into the coating apparatus 10 during the formation of the silicacoating, i.e. while the precursor materials are flowing into the coatingapparatus 10, and be of a flow rate which is substantially maintainedduring the continued formation of the silica coating. Further, thefluorine-containing compound may flow into the coating apparatus 10after formation of the silica coating, i.e. after the silica precursormaterials are no longer flowing into the coating apparatus 10, and be ofa flow rate which removes the coating and/or by-products resulting fromthe deposition of the coating on one or more portions of the coatingapparatus.

As above-noted, the fluorine-containing compound may flow into thecoating apparatus 10 prior to forming the silica coating. In thisembodiment, the fluorine-containing compound prevents formation of thecoating and/or by-products resulting from the deposition of the coatingon one or more portions of the coating apparatus 10. In otherembodiments where the fluorine-containing compound flows into thecoating apparatus 10 during or after formation of the silica coating,the fluorine-containing compound removes and/or prevents furtherformation of the coating and/or by-products on one or more portions ofthe coating apparatus 10.

Flowing the fluorine-containing compound into the coating apparatus 10inhibits the formation of the coating and/or by-products resulting fromthe deposition of the coating on one or more portions of the coatingapparatus 10 such as, for example, one or more surfaces of the coatingapparatus 10. In an embodiment, the coating and/or by-products areinhibited on a surface which at least partially define the exhaust gaspassage 56 such as, for example, the one or more sidewalls 58. Inanother embodiment, coating and/or by-product formation is inhibited ona surface within the exhaust gas passage 56 such as, for example, asurface of the at least one baffle 62. However, the method is notlimited to inhibiting coating and/or by-product formation on surfaceswhich define or are within the exhaust gas passages 56. Thus, in certainembodiments, coating and/or by-product formation is inhibited on atleast one face surface 53 of the coating apparatus 10.

EXAMPLES

A coating apparatus having a long axis was positioned transversely overa glass ribbon within a float bath chamber and utilized to form a silicacoating thereon. A non-oxidizing atmosphere of a mixture of nitrogen andhydrogen was maintained in the float bath chamber. The pressure in thefloat batch chamber was maintained at essential atmospheric pressure.The approximate glass ribbon temperature and internal temperature of thecoating apparatus for Examples 1-5 are provided in Table 1, below.

To form the silica coating, gaseous precursor materials were mixed andflowed into the coating apparatus. The gaseous mixture of precursormaterials comprised SiH₄, O₂, C₂H₄. The gaseous mixture also comprisedN₂ as a diluent. The flow rate of SiH₄ into the coating apparatus forExamples 1-5 is provided, below.

The coating apparatus had two exhaust gas passages and substantially allof the spent/unused precursor materials were exhausted from the floatbath chamber through the exhaust gas passages. A gas distribution tubewas positioned within each exhaust gas passage and provided to extendparallel to the long axis of the coating apparatus. Each gasdistribution tube included a hollow cylindrical portion and had aplurality of equally spaced holes formed therein.

Prior to forming the silica coating, a gaseous mixture of anhydrous HFand N₂ flowed into the coating apparatus and was introduced into eachexhaust gas passage via the gas distribution tubes. The flow of the HFand N₂ mixture was split between and directed into the gas distributiontubes before the gaseous mixture of HF/N₂ was introduced into theexhaust gas passages. The total flow rates of HF and N₂ for Examples 1-5are provided, below. The flow of the HF/N₂ mixture was maintained whilethe silica coating was formed.

TABLE 1 EXPERIMENTAL CONDITIONS FOR EXAMPLES 1-5 SiH₄ HF N₂ Coating flowflow flow Pressure Apparatus Glass Ribbon rate rate rate (atmo- Temp.Temp. Example (slm) (slm) (slm) spheres) (° F.) (° F.) 1 1.6 20 10 1 350~1200-1250 2 1.6 10 10 1 350 ~1200-1250 3 1.6 8 10 1 350 ~1200-1250 41.6 6 10 1 350 ~1200-1250 5 1.6 4 10 1 350 ~1200-1250

As was observed under the conditions reported for Examples 1-5 and willbe described below, flowing a fluorine-containing compound such as HFinto the coating apparatus while depositing the silica coating on theglass substrate inhibits the formation of the coating and/or byproductson one or more portions of the coating apparatus. Additionally, thesilica coating formed on the glass substrate comprises no fluorine oronly trace amounts thereof.

Under the conditions of Examples 1-3, inhibition of the formation of thecoating and/or byproducts on surfaces defining the exhaust passages wasexcellent. Under the conditions of Example 4, inhibition of theformation of the coating and/or byproducts on the aforementionedsurfaces was sufficient but not as good as observed under the conditionsreported for Examples 1-3. Under the conditions of Example 5, inhibitionof the formation of the coating and/or byproducts on the surfacesdefining the exhaust gas passages was not as good as observed under theconditions reported for Example 4.

The foregoing description is considered as illustrative only of theprinciples of the invention. Further, since numerous modifications andchanges will readily occur to those skilled in the art, it is notdesired to limit the invention to the exact construction and processesshown and described herein. Accordingly, all suitable modifications andequivalents may be considered as falling within the scope of theinvention as defined by the claims which follow.

The reader's attention is directed to all papers and documents which arefiled concurrently with or previous to this specification in connectionwith this application and which are open to public inspection with thisspecification, and the contents of all such papers and documents areincorporated herein by reference.

All of the features disclosed in this specification (including anyaccompanying claims, abstract and drawings), and/or all of the steps ofany method or process so disclosed, may be combined in any combination,except combinations where at least some of such features and/or stepsare mutually exclusive.

Each feature disclosed in this specification (including any accompanyingclaims, abstract and drawings) may be replaced by alternative featuresserving the same, equivalent or similar purpose, unless expressly statedotherwise. Thus, unless expressly stated otherwise, each featuredisclosed is one example only of a generic series of equivalent orsimilar features.

The invention is not restricted to the details of the foregoingembodiment(s). The invention extends to any novel one, or any novelcombination, of the features disclosed in this specification (includingany accompanying claims, abstract and drawings), or to any novel one, orany novel combination, of the steps of any method or process sodisclosed.

1-21. (canceled)
 22. A method of depositing a coating utilizing acoating apparatus, comprising: providing a coating apparatus above aglass substrate; and forming a coating on a surface of the glasssubstrate while flowing a fluorine-containing compound into the coatingapparatus, wherein the fluorine-containing compound inhibits theformation of the coating on one or more portions of the coatingapparatus.
 23. The method as claimed in claim 22, wherein the coatingcomprises an oxide of silicon.
 24. The method as claimed in claim 22,wherein the glass substrate is moving.
 25. The method as claimed inclaim 22, further comprising positioning the coating apparatus within adeposition chamber.
 26. The method as claimed in claim 22, wherein thecoating is formed on the surface of the glass substrate by chemicalvapor deposition.
 27. The method as claimed in claim 22, wherein theglass substrate is at a temperature of between about 1050° F. (566° C.)and 1400° F. (760° C.).
 28. The method as claimed in claim 22, whereinthe coating contains no fluorine or only trace amounts thereof.
 29. Themethod as claimed in claim 22, wherein the coating apparatus comprisesone or more exhaust gas passages and the fluorine-containing compound isintroduced into an exhaust gas passage.
 30. The method as claimed inclaim 22, wherein the fluorine-containing compound is anhydrous HF. 31.The method as claimed in claim 22, wherein the fluorine-containingcompound inhibits the formation of the coating within one or moreexhaust gas passages.
 32. The method as claimed in claim 22, wherein thefluorine-containing compound inhibits the formation of the coating on asurface of the coating apparatus.
 33. The method as claimed in claim 22,further comprising forming a gaseous mixture comprising asilicon-containing compound, an oxygen-containing compound and a radicalscavenger, flowing the gaseous mixture into the coating apparatus anddirecting the gaseous mixture through the coating apparatus to thesurface of the glass substrate.
 34. The method as claimed in claim 22,wherein the fluorine-containing compound flows into the coatingapparatus prior to forming the coating on the surface of the glasssubstrate.
 35. The method as claimed in claim 22, wherein the coating isa silica coating.
 36. The method as claimed in claim 29, wherein thefluorine-containing compound is introduced into each exhaust gas passagevia separate gas distribution tubes.
 37. The method as claimed in claim22, wherein the ratio of fluorine-containing compound tosilicon-containing compound flowing into the coating apparatus is equalto or greater than 2:1.
 38. The method as claimed in claim 37, whereinthe ratio of fluorine-containing compound to silicon-containing compoundflowing into the coating apparatus is equal to or greater than 4:1. 39.A method of depositing a coating utilizing a coating apparatus,comprising: providing a coating apparatus which comprises one or moreexhaust gas passages above a moving glass substrate; and forming asilica coating on a surface of the glass substrate which contains nofluorine or only trace amounts thereof while flowing afluorine-containing compound into the coating apparatus, wherein thefluorine-containing compound inhibits the formation of the silicacoating in the one or more exhaust gas passages.
 40. The method asclaimed in claim 39, wherein the glass substrate is at a temperature ofbetween about 1050° F. (566° C.) and 1400° F. (760° C.).
 41. The methodas claimed in claim 39, further comprising forming a gaseous mixturecomprising a silicon-containing compound, an oxygen-containing compoundand a radical scavenger, flowing the gaseous mixture into the coatingapparatus and directing the gaseous mixture through the coatingapparatus to the surface of the glass substrate and wherein the ratio offluorine-containing compound to silicon-containing compound flowing intothe coating apparatus is equal to or greater than 4:1.
 42. A coatedglass substrate comprising a coating, the coating being deposited byutilizing a coating apparatus, comprising: providing a coating apparatusabove a glass substrate; and forming a coating on a surface of the glasssubstrate while flowing a fluorine-containing compound into the coatingapparatus, wherein the fluorine-containing compound inhibits theformation of the coating on one or more portions of the coatingapparatus.